Process/Manufacturing Capabilities
We operate in a 20,000 sqft. Class 100 cleanroom with full MEMS manufacturing
capability for 150mm silicon, SOI, or glass wafers. Below are our standard process and manufacturing
capabilities. If you don't see a process or capability you are looking
for, contact us to see how we may be able to help.
Lithography
- Steppers
- 1x Aligners
- FS/BS Align & Expose (contact, proximity)
- Minimum CD = 1um
- Minimum Overlay < 1um
- Positive and Negative resist capability
- Polyimide coat/cure
|
Silicon Micromachining/RIE
- KOH Bulk Silicon wet etching
- Precision DRIE etching, Bosch process (SOI capable)
- Nitride
- Oxide
- Polysilicon
- O2 Plasma Strip/Clean
|
Metallization
- PVD Sputter (MRC, down and side sputter, DC/RF)
- E-Beam evaporator
- Metals: Au, NiFe (Permalloy), Al, Ti, TiN, TiW, Pt, Pd, CrSi
- Electroplating: Au, Cu, Ni
- TMP (Through-mask plating) and shadow mask processes
|
Thin Films/Diffusion
- PECVD Films: Nitride, Oxide, Oxynitride
- LPCVD Films: Nitride, Polysilicon, TEOS, POCL3 doped polysilicon
- Oxidation: Wet & Dry Thermal oxidation
- High Temperature Anneal
|
Wet Etch/Cleans
- Standard Cleans: SC1, SC2, Pirhana, BOE, Solvent Strip
- Wet Metal Etch: Al, Au (KI+I & Aqua Regia), Cr, Pd, Pt, Ti/TiW
- Other Wet Etch: HF Release, Nitric, rinse/dry
|
Wafer Bonding
- Bond alignment < 5um (front to back)
- Bond pressure up to 6 bar, vacuum to 1 Torr, Temp up to 500C
- IR bond inspection
- Anodic bonding
- Low temp Silicon/Oxide Fusion Bonding
- AuSi Eutectic Bonding
- Glass Frit Bonding
|
Backgrind/Polish/Dice
- Backgrind (down to 250um)
- Silicon polish/CMP
- Wafer dicing
|
Metrology/Test Probe
- Automated wafer probing/parametric test
- Thin Film Measurement (Nanospec)
- Microscope Inspection/Automated Pattern Inspection
- Particle Inspection (Tencor)
- Step Height Profilometer
- 4-point probe (metal thickness)
- Stress guage (warp/bow)
|
Manufacturing Execution System (MES)
- Automated WIP tracking
- Full manufacturing traceability
- Inline and probe data collection & archival
|
|
